Functional Materials Division Gilbert Chin Scholarship

Scholarship Provided by : third party

Scholarship Amount

$2,000 USD

Application Deadline

March 15, 2018


One scholarship is available to an undergraduate student in their sophomore and junior years who is studying subjects in relation to synthesis and processing structure properties and performance of electronic photonic magnetic and superconducting materials as well as materials used in packaging and interconnecting such materials in device structures. An additional $500 for travel expenses is available to the recipient in order to personally accept the award at the TMS Annual Meeting and Exhibition.

The applicant must be a student member of Material Advantage-Applicants must be enrolled full-time in a metallurgical/materials science engineering program at a qualified college/university-Applicants must be undergraduate sophomores or junior unless otherwise noted-Relatives of members of the funding committee/division are not eligible-Submitted coursework must be relevant to the scholarship for which the student is applyingFor more information or to apply please visit the scholarship provider's website.

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